ARCH combines application expertise and advanced technologies to serve medical, aerospace and defense, semiconductor, and other precision-driven industrial markets. We provide optimized manufacturing operations to deliver tight-tolerance complex parts. We focus on customer service to increase supply chain value.
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Find many great new & used options and get the best deals for Super Grind Inner Grinding Arch Trimmer Machine for Dental Lab Equipment 4500rpm at the best online prices at …
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Find many great new & used options and get the best deals for 4500rpm Dental Grind Inner Lab Model Arch Trimming Equipment Machine Pro at the best online prices at …
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Samuel P702RS Narrow Automatic Arch Strapping Machine - 5MM, 6MM, and 9MM Strap Widths. High Speed Strapping. High Volume Arch Bander. Used in Printing & Mailing. Requires specific strapping. Up to 60 cycles a minute. see full details. SAM-P702RS. In stock.
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AIT wafer and substrate grinding and thinning temporary bonding adhesive tapes are made in the United States with Company Service Centers in China and USA. The high temperature controlled release tape has a conformable compressible layer of 150 and 300 micron thickness to accommodate bumped wafers with gold or solder bumps respectively.
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Using my homemade wooden lathe for some metal work
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The StraPack RQ-8YAO is an automatic, side seal strapping machine that straps palletized products using polypropylene or polyester strapping. The RQ-8YAO operates as a stand-alone unit or can be integrated into a packaging line. The arch sword penetrates the pallet void and straps the product to …
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Back grinding tape is used to protect the circuit surface r from damage by foreign matter, chipping, cracking and contamination during back grinding process. With developments of jumbo-sized and thinned wafer and high-bumped wafer, the function required to the BG tape are (1) low contamination levels, (2) highly close contact to wafer-, and (3 ...
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IXAER Dental Grind Inner Laboratory Model 4500rpm Arch Trimmer Trimming Lab Equipment (US IN STOCK) 5.0 out of 5 stars. 2. $115.99. $115. . 99 ($115.99/Count) 5% coupon applied at checkout. Extra 5% off with coupon.
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Protection Tape Remover for Backgrinding Process. This equipment removes protection tape from the wafer patterned surface after the back-grinding process. Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.
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Founded in 1934, KEHREN is a well-established designer and builder of high-precision grinding machine tools and systems under the following categories: vertical grinding centers, vertical grinding centers with portal design, surface grinders with rotary tables and horizontal spindles, and surface grinders with dual rotary tables and vertical ...
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Find many great new & used options and get the best deals for Super Grind Inner Grinding Arch Trimmer Machine for Dental Lab Equipment 4500rpm at the best online prices at …
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Logosol Clivus ATV Log Skidding Arch. $1,999.99. Add to Wish List Add to Compare. #FA025. LogRite Fetching Arch. $2,499.99. Add to Wish List Add to Compare. #BA022H. Logrite Buck Skidding Arch.
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The new standard in machining and finishing services. ARCH is committed to continually improve our processes and manufacturing practices in compliance with the highest possible standards. Our certifications demonstrate that our quality management systems precisely meet those required in the aerospace, medical, defense, and automotive fields.
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The AUTOPAC 300 is a ideal arch strapper for moderate to high volume applciations where 3/8″ (9mm) and 1/2″ (12mm) is the preferred material. The AUTOPAC 300 IS FAST CONSISTENT AND RELIABLE. It is all the user friendly features, usually found on machines costing thousands of dollars more.
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Samuel's P702 Automatic Strapping Machine is the latest in a series of Arch Strapping Equipment that offers superior performance with easy to use controls. The DC brushless motor technology provides the highest level of performance available in Strapping Equipment today, while the "Cam Actuated," one-piece track design, assures precise parallel ...
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The inherent stress relaxation capability of this tape, curtails wafer bow that would otherwise arise after back grinding due to residual stress during tape lamination. Moreover, by dispersing stress during back grinding of bump wafers, this tape prevents wafer damage and wafer dimples, while enhancing wafer thickness accuracy. 2.
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